CIRCUIT BOARD DESIGN
PROTOTYPE ASSEMBLY
TURNKEY / PRODUCTION ASSEMBLY
AREA ARRAY TECHNOLOGY
(BGA,
CBGA, PGA,CGA)
SURFACE MOUNT ASSEMBLY
(FINE
PITCH COMPONENTS TO 15MIL)
THRU-HOLE ASSEMBLY
IN-CIRCUIT TEST
FUNCTIONAL TEST
BURN-IN TESTING
CONFORMAL COATING
POTTING / ENCAPSULATING
CHASSIS ASSEMBLY
RETROFITS / UPGRADES
CABLING / WIRING
MODIFICATIONS
FIELD INSTALLATIONS
