Understanding the value of Post-build and DFM Reporting

Along with product quality and On-Time Delivery, TJM takes great pride in providing our customers with effective, proactive communication.  Part of this communication is our Post Build/DFM report. TJM’s Post Build report at the conclusion of a manufacturing project documents any material, process, data or document challenges experienced at each stage of the build from procurement to shipment. While these challenges or questions will be communicated throughput the manufacturing process, the report is designed to capture tjm-post-reportall of this information into one concise “What did we learn, how do we make the next revision better, and what will produce the best yield?” document. Another good question is “how much time will this information keep me from wasting next go around?” Whether the hardware we are building is low volume test or industrial equipment, or product that will be eventually be built offshore in volume production, manufacturability feedback at this stage is invaluable to product success. Below are the key sections covered in the Post Build/DFM Report that we provide our customers.

Procurement – Any issues at the quote or purchasing stage regarding material or component availability, lead time issues or obsolescence will  be presented to the customer at the quote or procurement stage, but will also be noted on the Post build report.

Data – Should our CAM engineer, or our board fabricators CAM personnel experience any difficulty with importing Gerber/Board Fabrication data including DRC conflicts, ASCII data import, test program development challenges, the Post Build report will document any errors or questions that come up and how they were resolved.

PCB DFM – Occasionally pad geometries or component footprints are incorrect (or not optimal), surface finish and solder-ability impede yield, solder masking (coverage or lack of) can create either solder bridges (or thieving from BGA pads), silkscreen (designator & polarity markings not clear), thermal relief considerations causing thermal mismatch on SMT pads or heavy copper planes impeding thru-hole barrel fill, pcb panelization optimization and ease of de-paneling.

Mods (when required) – documented, effective methods/processes used, authorized personnel.

Documentation – Part number errors, clarifications, improvements to notes will be presented/suggested.
Design for Test (DFT) – Our test program development software can produce net list access and testability reports. Our In-Circuit test technician will also document board handling considerations for conveyor fed systems.